Akihiro DOHYA


Packaging Technology Trends and Challenges for System-in-Package
Akihiro DOHYA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C  No. 12  pp. 1756-1762
Type of Manuscript:  INVITED PAPER (Special Issue on Integrated Systems with New Concepts)
Category: 
Keyword: 
packaging technologysystem-in-packageSIPSoCCSP
 Summary | Full Text:PDF

High Performance Packaging Technology for Supercomputers
Toshihiko WATARI Akihiro DOHYA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C  No. 8  pp. 2331-2336
Type of Manuscript:  Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
Category: Packaging Technology for Main Frame
Keyword: 
 Summary | Full Text:PDF