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Vol/No/Title/Authors number Price(including tax)
Vol.J101-C No.2
Simultaneous Measurement of Residual Stress at Interfaces between Die Bonding Paste Resins and Cu-Substrates, and Resins and Ag-Fillers in Semiconductor Packages
Takeshi KAKARA, Atsushi IZUMI, Midori WAKABAYASHI, Dai NAGASHIMA,
1 ¥3240
Total: ¥3,240