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Present Status and Future Trend of Large-Scale/High-Speed/High-Precision Simulation Technology
Hideki ASAI Yuta INOUE Shingo OKADA
C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2016/05/01
Online ISSN: 1881-0217
Type of Manuscript: INVITED PAPER (Special Section on Recent Progress in Simulation Techniques for Electronics)
circuit analysis, electromagnetic analysis, large-scale/high-speed/high-precision simulation, SI/PI/EMI simulation, 3-D,
Full Text(in Japanese): FreePDF(929.6KB)
With the progress of high-density and high-frequency techniques in the chip, package and board co-design, a variety of problems related to signal/power integrity (SI/PI) and electromagnetic interference (EMI) have become very significant. In this tutorial paper, the SI/PI/EMI issues are summarized, and the current status and future trend of CAE (Computer-Aided Engineering) techniques for SI/PI/EMI design are described from the viewpoints of the algorithm and hardware implementation.