Present Status and Future Trend of Large-Scale/High-Speed/High-Precision Simulation Technology

Hideki ASAI  Yuta INOUE  Shingo OKADA  

Publication
C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)   Vol.J99-C   No.5   pp.182-192
Publication Date: 2016/05/01
Online ISSN: 1881-0217
DOI: 
Type of Manuscript: INVITED PAPER (Special Section on Recent Progress in Simulation Techniques for Electronics)
Category: 
Keyword: 
circuit analysis,  electromagnetic analysis,  large-scale/high-speed/high-precision simulation,  SI/PI/EMI simulation,  3-D,  

Full Text(in Japanese): FreePDF(929.6KB)


Summary: 
With the progress of high-density and high-frequency techniques in the chip, package and board co-design, a variety of problems related to signal/power integrity (SI/PI) and electromagnetic interference (EMI) have become very significant. In this tutorial paper, the SI/PI/EMI issues are summarized, and the current status and future trend of CAE (Computer-Aided Engineering) techniques for SI/PI/EMI design are described from the viewpoints of the algorithm and hardware implementation.