Sheet-Shape Molding Resin Realizing Low Warpage for Fan-Out Panel Level Package

Kazuhiro KIKUCHI  Yuusuke NEZU  Takashi SUGINO  

Publication
C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)   Vol.J101-C   No.7   pp.273-281
Publication Date: 2018/07/01
Online ISSN: 1881-0217
DOI: 
Type of Manuscript: PAPER
Category: 
Keyword: 
FOWLP,  FOPLP,  embedded die,  molding resin,  warpage,  epoxy,  

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Summary: 
Sheet-formed epoxy molding compounds which enable low panel warpage for Fan-out Panel Level Package (FOPLP) are examined without highly filled silica particles. The rigid epoxy resin in the molding compound is partially replaced by relatively more flexible epoxy resin, and their viscoelasticity, thermo-mechanical characteristics, heat resistance and die shear strength were evaluated. In addition, the amount of warpage deformation is experimentally observed when they construct bilayer and FOPLP structure. As a result, they exhibited heat resistance and adhesiveness applicable to semiconductor packages, panel warpage is reduced to one fifth by strong stress relaxation in a sufficiently wide temperature range.