Simultaneous Measurement of Residual Stress at Interfaces between Die Bonding Paste Resins and Cu-Substrates, and Resins and Ag-Fillers in Semiconductor Packages

Takeshi KAKARA  Atsushi IZUMI  Midori WAKABAYASHI  Dai NAGASHIMA  

Publication
C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)   Vol.J101-C   No.2   pp.99-100
Publication Date: 2018/02/01
Online ISSN: 1881-0217
Type of Manuscript: Special Section LETTER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
Category: 
Keyword: 
semiconductor packages,  interface residual stress,  simultaneous measurement,  two-dimensional detector,  

Full Text(in Japanese): PDF(408.5KB)
>>Buy this Article


Summary: 
Residual stress at interfaces between die bonding paste resins and Cu-substrates, and the resins and Ag-fillers in semiconductor packages under heating process was investigated by an X-ray diffraction technique. The change in the residual stress indicated that the thermal expansion of the paste resins was suppressed by a silicone-based chip.