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Simultaneous Measurement of Residual Stress at Interfaces between Die Bonding Paste Resins and Cu-Substrates, and Resins and Ag-Fillers in Semiconductor Packages
Takeshi KAKARA Atsushi IZUMI Midori WAKABAYASHI Dai NAGASHIMA
C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2018/02/01
Online ISSN: 1881-0217
Type of Manuscript: Special Section LETTER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
semiconductor packages, interface residual stress, simultaneous measurement, two-dimensional detector,
Full Text(in Japanese): PDF(408.5KB)
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Residual stress at interfaces between die bonding paste resins and Cu-substrates, and the resins and Ag-fillers in semiconductor packages under heating process was investigated by an X-ray diffraction technique. The change in the residual stress indicated that the thermal expansion of the paste resins was suppressed by a silicone-based chip.