Examination of TMV First Process for FO-WLP with Cu Pillar Substrate

Hiroshi YAMADA  Akihiko HAPPOYA  Shuzo AKEJIMA  Hirokazu EZAWA  

Publication
C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)   Vol.J101-C   No.2   pp.66-73
Publication Date: 2018/02/01
Online ISSN: 1881-0217
Type of Manuscript: Special Section PAPER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
Category: 
Keyword: 
Fan out wafer level package,  Through mold via,  Cu pillar,  TMV first process,  residue of the resin,  

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Summary: 
This paper examines the possibility of realizing the TMV first process in which Cu pillars on the substrate are pressed into the FO-WLP resin. It was found that optimizing the resin printing thicknesses and Cu pillar heights enables the Cu pillar tops to conform to the resin surface. Furthermore, it was found that eliminating the oxidation and the residue of the resin on the Cu pillar top surface leads to a reduction in the values of the RDL resistances. From these results, it was clarified that the TMV first process has potential for application to the 3D-FOWLP.