3D Integration Technology for High Performance Car-electronics Sensors

Yuki OHARA  Taku SUZUKI  Yuki INAGAKI  Atsushi MIZUTANI  Kazushi ASAMI  

Publication
C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)   Vol.J101-C   No.2   pp.50-57
Publication Date: 2018/02/01
Online ISSN: 1881-0217
Type of Manuscript: INVITED PAPER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
Category: 
Keyword: 
3D integration technology,  TSV,  solder-TSV,  self-assembly,  low-cost processing,  

Full Text(in Japanese): FreePDF(2MB)


Summary: 
To realize self-driving cars or driver assistant system, high performance and small footprint sensors are required. 3D integration (3DI) technology using TSV is a promising technology for those demands. In this paper, low cost processes for 3DI are described, which is solder-TSV technology and self-assemble technology.