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3D Integration Technology for High Performance Car-electronics Sensors
Yuki OHARA Taku SUZUKI Yuki INAGAKI Atsushi MIZUTANI Kazushi ASAMI
C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2018/02/01
Online ISSN: 1881-0217
Type of Manuscript: INVITED PAPER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
3D integration technology, TSV, solder-TSV, self-assembly, low-cost processing,
Full Text(in Japanese): FreePDF(2MB)
To realize self-driving cars or driver assistant system, high performance and small footprint sensors are required. 3D integration (3DI) technology using TSV is a promising technology for those demands. In this paper, low cost processes for 3DI are described, which is solder-TSV technology and self-assemble technology.