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A Novel Chip Place Process for FO-WLP Using a New Tape Expansion Machine
Masatomo NAKAMURA Shinya TAKYU Naoya OKAMOTO Toshiaki MENJO
C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2018/02/01
Online ISSN: 1881-0217
Type of Manuscript: Special Section LETTER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
FO-WLP, expansion, expansion machine device, expansion tape,
Full Text(in Japanese): PDF(619.2KB)
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General Mold-first FO-WLP process still has chip level process called Chip Pick-up and Place. We have proposed Tape Expansion Process using a new expansion machine device and an expansion tape. This can be instead of Chip Pick-up and Place process. We invested the relationship between the expansion ability and the tape properties.