A Novel Chip Place Process for FO-WLP Using a New Tape Expansion Machine

Masatomo NAKAMURA  Shinya TAKYU  Naoya OKAMOTO  Toshiaki MENJO  

Publication
C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)   Vol.J101-C   No.2   pp.103-106
Publication Date: 2018/02/01
Online ISSN: 1881-0217
Type of Manuscript: Special Section LETTER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
Category: 
Keyword: 
FO-WLP,  expansion,  expansion machine device,  expansion tape,  

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Summary: 
General Mold-first FO-WLP process still has chip level process called Chip Pick-up and Place. We have proposed Tape Expansion Process using a new expansion machine device and an expansion tape. This can be instead of Chip Pick-up and Place process. We invested the relationship between the expansion ability and the tape properties.