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The Influence of Water Absorption of Adhesive Film on Adhesive Film Broken
Keishi FUSE Shinya TAKYU
C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2018/02/01
Online ISSN: 1881-0217
Type of Manuscript: Special Section LETTER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
die bonding tape, adhesive film broken, dicing, pick-up,
Full Text(in Japanese): PDF(436.8KB)
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As chip size becomes smaller, adhesive film broken is focused in the semiconductor market. We focused on the influence of water absorption during dicing, and concluded that adhesive film becomes fragile.