The Influence of Water Absorption of Adhesive Film on Adhesive Film Broken

Keishi FUSE  Shinya TAKYU  

Publication
C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)   Vol.J101-C   No.2   pp.101-102
Publication Date: 2018/02/01
Online ISSN: 1881-0217
Type of Manuscript: Special Section LETTER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
Category: 
Keyword: 
die bonding tape,  adhesive film broken,  dicing,  pick-up,  

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Summary: 
As chip size becomes smaller, adhesive film broken is focused in the semiconductor market. We focused on the influence of water absorption during dicing, and concluded that adhesive film becomes fragile.