Manufacture and Performance of a 60GHz-Band High-Efficiency Antenna with a Thick Resin Layer and the Feed through a Hole in a Silicon Chip

Jun ASANO  Jiro HIROKAWA  Hiroshi NAKANO  Yasutake HIRACHI  Hiroshi ISONO  Atsushi ISHII  Makoto ANDO  

Publication
IEICE TRANSACTIONS on Communications   Vol.E96-B   No.12   pp.3108-3115
Publication Date: 2013/12/01
Online ISSN: 1745-1345
DOI: 10.1587/transcom.E96.B.3108
Print ISSN: 0916-8516
Type of Manuscript: PAPER
Category: Antennas and Propagation
Keyword: 
on-chip antenna,  connecting loss,  radiation efficiency,  reverberation chamber,  

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Summary: 
As a first step towards the realization of high-efficiency on-chip antennas for 60GHz-band wireless personal area networks, this paper proposes the fabrication of a patch antenna placed on a 200µm thick dielectric resin and fed through a hole in a silicon chip. Despite the large tan δ of the adopted material (0.015 at 50GHz), the thick resin reduces the conductor loss at the radiating element and a radiation efficiency of 78%, which includes the connecting loss from the bottom is predicted by simulation. This calculated value is verified in the millimeter-wave band by experiments in a reverberation chamber. Six stirrers are installed, one on each wall in the chamber, to create a statistical Rayleigh environment. The manufactured prototype antenna with a test jig demonstrates the radiation efficiency of 75% in the reverberation chamber. This agrees well with the simulated value of 76%, while the statistical measurement uncertainty of our handmade reverberation chamber is calculated as ±0.14dB.