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Microwave Characterization of Copper-Clad Dielectric Laminate Substrates
IEICE TRANSACTIONS on Electronics
Publication Date: 2007/12/01
Online ISSN: 1745-1353
Print ISSN: 0916-8516
Type of Manuscript: INVITED PAPER (Special Section on Recent Technologies for Microwave and Millimeter-wave Passive Devices)
microwave measurement, complex permittivity, conductivity, dielectric substrates,
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Microwave measurement methods necessary to characterize copper-clad dielectric laminate substrates are reviewed to realize more precise design of planar circuits: that is, the balanced-type circular disk resonator method for the relative complex permittivity in the normal direction εrn and tan δn, the cavity resonator method and the cut-off waveguide method for one in the tangential direction εrt and tan δt, and the dielectric resonator method for the surface and interface conductivity of copper foil σs and σi. The measured results of the frequency and temperature dependences of these parameters are presented for a PTFE substrate and a copper-clad glass cloth PTFE laminate substrate.