For Full-Text PDF, please login, if you are a member of IEICE,|
or go to Pay Per View on menu list, if you are a nonmember of IEICE.
On-Chip Thermal Gradient Analysis and Temperature Flattening for SoC Design
Takashi SATO Junji ICHIMIYA Nobuto ONO Koutaro HACHIYA Masanori HASHIMOTO
IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2005/12/01
Print ISSN: 0916-8508
Type of Manuscript: Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Prediction and Analysis
thermal simulation, thermal gradient, temperature flattening, clock skew, reliability, timing,
Full Text: PDF(959.9KB)
>>Buy this Article
This paper quantitatively analyzes thermal gradient of SoC and proposes a thermal flattening procedure. First, the impact of dominant parameters, such as area occupancy of memory/logic block, power density, and floorplan on thermal gradient are studied quantitatively. Temperature difference is also evaluated from timing and reliability standpoints. Important results obtained here are 1) the maximum temperature difference increases with higher memory area occupancy and 2) the difference is very floorplan sensitive. Then, we propose a procedure to amend thermal gradient. A slight floorplan modification using the proposed procedure improves on-chip thermal gradient significantly.