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Novel MMIC Transmission Lines Using Thin Dielectric Layers
IEICE TRANSACTIONS on Electronics Vol.E75-C No.6 pp.713-720
Publication Date: 1992/06/20
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on MMIC Technology)
Full Text: PDF(736.8KB)
Novel transmission line structures for multilayer MMICs, which are constructed with thin dielectric layers on a GaAs wafer surface, are theoretically and experimentally investigated. Five thin film transmission line structures are discussed in this paper: (1) Microstrip lines, (2) Inverted microstrip lines, (3) Triplate lines, (4) Trapezoidal microstrip lines and (5) Valley microstrip lines. These transmission line structures are fabricated using thin polyimide films and chemical etching.