Design of High-Speed Easy-to-Expand CC-Link Parallel Communication Module Based on R-IN32M3

Yeong-Mo YEON  Seung-Hee KIM  

Publication
IEICE TRANSACTIONS on Information and Systems   Vol.E102-D   No.1   pp.116-123
Publication Date: 2019/01/01
Online ISSN: 1745-1361
DOI: 10.1587/transinf.2018EDP7101
Type of Manuscript: PAPER
Category: Information Network
Keyword: 
CC-Link,  dual-port RAM (DPRAM),  remote I/O,  complex programmable logic device (CPLD),  R-IN32M3,  

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Summary: 
The CC-Link proposed by the Mitsubishi Electric Company is an industrial network used exclusively in most industries. However, the probabilities of data loss and interference with equipment control increase if the transmission time is greater than the link scan time of 381µs. The link scan time can be reduced by designing the CC-Link module as an external microprocessor (MPU) interface of R-IN32M3; however, it then suffers from expandability issues. Thus, in this paper, we propose a new CC-Link module utilizing R-IN32M3 to improve the expandability. In our designed CC-Link module, we devise a dual-port RAM (DPRAM) function in an external I/O module, which enables parallel communication between the DPRAM and the external MPU. Our experiment with the implemented CC-Link prototype demonstrates that our CC-Link design improves the communication speed owing to the parallel communication between DPRAM and external MPU, and expandability of remote I/O. Our design achieves miniaturization of the CC-Link module, wiring reduction, and an approximately 30% reduction in the link scan time. Furthermore, because we utilize both the Renesas R-IN32M3 and Xilinx XC95144XL chips widely used in diverse application areas, the designed CC-Link module reduces the investment cost. The proposed design is expected to significantly contribute to the utilization of the programmable logic controller memory and I/O expansion for factory automation and improvement of the investment efficiency in the flat panel display industry.