Recent Progress in the Development of Large-Capacity Integrated Silicon Photonics Transceivers

Yu TANAKA  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E102-C   No.4   pp.357-363
Publication Date: 2019/04/01
Online ISSN: 1745-1353
DOI: 10.1587/transele.2018ODI0007
Type of Manuscript: INVITED PAPER (Special Section on Progress in Optical Device Technology for Increasing Data Transmission Capacity)
Category: 
Keyword: 
silicon photonics,  optical interconnection,  wavelength division multiplexing,  

Full Text: FreePDF(1.6MB)


Summary: 
We report our recent progress in silicon photonics integrated device technology targeting on-chip-level large-capacity optical interconnect applications. To realize high-capacity data transmission, we successfully developed on-package-type silicon photonics integrated transceivers and demonstrated simultaneous 400 Gbps operation. 56 Gbps pulse-amplitude-modulation (PAM) 4 and wavelength-division-multiplexing technologies were also introduced to enhance the transmission capacity.