Simulation of Temperature Distribution under Periodic Heating for Analysis of Thermal Diffusivity in Nanometer-Scale Thermoelectric Materials

Naomi YAMASHITA  Yuya OTA  Faiz SALLEH  Mani NAVANEETHAN  Masaru SHIMOMURA  Kenji MURAKAMI  Hiroya IKEDA  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E101-C   No.5   pp.347-350
Publication Date: 2018/05/01
Online ISSN: 1745-1353
DOI: 10.1587/transele.E101.C.347
Type of Manuscript: BRIEF PAPER
Category: 
Keyword: 
thermal diffusivity,  ac calorimetry,  heat diffusion equation,  AlN,  

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Summary: 
With the aim of characterizing the thermal conductivity for nanometer-scale thermoelectric materials, we have constructed a new measurement system based on ac calorimetry. Analysis of the obtained data requires time-evolution of temperature distribution in nanometer-scale material under periodic heating. In this study, we made a simulation using a C#-program for time-dependent temperature distribution, based on 2-dimensional heat-diffusion equation including the influence of heat emission from material edges. The simulation was applied to AlN with millimeter-scale dimensions for confirming the validity and accuracy. The simulated thermal diffusivity for 10×75-mm2-area AlN was 1.3×10-4 m2/s, which was larger than the value set in the heat-diffusion equation. This overestimation was also observed in the experiment. Therefore, our simulation can reproduce the unsteady heat conduction and be used for analyzing the ac calorimetry experiment.