Assembly Technologies for Integrated Transmitter/Receiver Optical Sub-Assembly Modules

Keita MOCHIZUKI  Tadashi MURAO  Mizuki SHIRAO  Yoshiyuki KAMO  Nobuyuki YASUI  Takahiro YOSHIMOTO  Daisuke ECHIZENYA  Masaya SHIMONO  Hidekazu KODERA  Masamichi NOGAMI  Hiroshi ARUGA  

IEICE TRANSACTIONS on Electronics   Vol.E100-C   No.2   pp.187-195
Publication Date: 2017/02/01
Online ISSN: 1745-1353
Type of Manuscript: INVITED PAPER (Special Section on Fabrication Technologies Supporting the Photonic/Nanostructure Devices)
hybrid integration,  optical sub-assembly,  100 Gb/s Ethernet,  

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We have succeeded in developing three techniques, a precise lens-alignment technique, low-loss built-in Spatial Multiplexing optics and a well-matched electrical connection for high-frequency signals, which are indispensable for realizing compact high-performance TOSAs and ROSAs employing hybrid integration technology. The lens position was controlled to within ±0.3 µm by high-power laser irradiation. All components comprising the multiplexing optics are bonded to a prism, enabling the insertion loss to be held down to 0.8 dB due to the dimensional accuracy of the prism. The addition of an FPC layer reduced the impedance mismatch at the junction between the FPC and PCB. We demonstrated a compact integrated four-lane 25 Gb/s TOSA (15.1 mm × 6.5 mm × 5.6 mm) and ROSA (17.0 mm × 12.0 mm × 7.0 mm) using the built-in spatial Mux/Demux optics with good transmission performance for 100 Gb/s Ethernet. These are respectively suitable for the QSFP28 and CFP2 form factors.