Keyword : wafer-level chip scale package

Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology
Hiroyuki ITO  Hideyuki SUGITA  Kenichi OKADA  Tatsuya ITO  Kazuhisa ITOI  Masakazu SATO  Ryozo YAMAUCHI  Kazuya MASU 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2007/03/01
Vol. E90-C  No. 3  pp. 641-643
Type of Manuscript: LETTER
Category: Microwaves, Millimeter-Waves
Keyword: 
wafer-level chip scale package,  RF CMOS,  passive device, 
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