Publication: C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2011/11/01
Vol. J94-C
No. 11
pp. 419-426
Type of Manuscript: Special Section PAPER (Special Issue on High-speed & High-density Packaging and Integration Technologies for Microelectronic Devices)
Category:
Keyword:
underfill,
filler,
solder,
nanoindentation,
Young's modulus,
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