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Keyword : hybrid integration

Optical Microsensors Integration Technologies for Biomedical Applications Eiji HIGURASHI Renshi SAWADA Tadatomo SUGA
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2009/02/01 Vol. E92-C No. 2 pp. 231-238 Type of Manuscript: Special Section PAPER (Special Section on Recent Advances in Integrated Photonic Devices) Category: INVITED Keyword: microsensors, hybrid integration, passive alignment, low temperature bonding, laser Doppler flowmetry,
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Low-Temperature Au-to-Au Bonding for LiNbO₃/Si Structure Achieved in Ambient Air Ryo TAKIGAWA Eiji HIGURASHI Tadatomo SUGA Satoshi SHINADA Tetsuya KAWANISHI
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2007/01/01 Vol. E90-C No. 1 pp. 145-146 Type of Manuscript: Special Section LETTER (Special Section on Microoptomechatronics) Category: Micro/Nano Fabrication Keyword: low-temperature bonding, Au-to-Au bonding, surface-activated bonding, lithium niobate/silicon structure, hybrid integration,
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Novel Stacked Packaging Structure Using Silica-Based PLC with Integrated Micro-Mirrors and Its Application to 8ch PD Array Module Ikuo OGAWA Makoto ABE Yoshiyuki DOI Senichi SUZUKI
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2005/08/01 Vol. E88-C No. 8 pp. 1552-1558 Type of Manuscript: Special Section PAPER (Special Section on Recent Development of Electro-Mechanical Devices--Selected Papers from International Session on Electro-Mechanical Devices 2004 (IS-EMD2004)--) Category: Optical Interconnection Keyword: silica-based PLC, micro-mirror, stacked packaging, hybrid integration,
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Hybrid-Integrated Smart Pixels for Dense Optical Interconnects Hiroyuki TSUDA Tatsushi NAKAHARA Takashi KUROKAWA
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2001/12/01 Vol. E84-C No. 12 pp. 1771-1777 Type of Manuscript: Special Section PAPER (Special Issue on Integrated Systems with New Concepts) Category: Keyword: smart pixel, optical interconnect, hybrid integration, CMOS, VCSEL,
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Polarization Insensitive SOA-PLC Hybrid Integrated Michelson Interferometric Wavelength Converter and Its Application to DWDM Networks Rieko SATO Toshio ITO Katsuaki MAGARI Akira OKADA Manabu OGUMA Yasumasa SUZAKI Yoshihiro KAWAGUCHI Yasuhiro SUZUKI Akira HIMENO Noboru ISHIHARA
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2001/05/01 Vol. E84-C No. 5 pp. 571-578 Type of Manuscript: Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications) Category: Optical Systems and Technologies Keyword: wavelength conversion, cross-phase modulation, ITU-T grid, hybrid integration, polarization insensitive,
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Polarization Insensitive SOA-PLC Hybrid Integrated Michelson Interferometric Wavelength Converter and Its Application to DWDM Networks Rieko SATO Toshio ITO Katsuaki MAGARI Akira OKADA Manabu OGUMA Yasumasa SUZAKI Yoshihiro KAWAGUCHI Yasuhiro SUZUKI Akira HIMENO Noboru ISHIHARA
Publication: IEICE TRANSACTIONS on Communications Publication Date: 2001/05/01 Vol. E84-B No. 5 pp. 1197-1204 Type of Manuscript: Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications) Category: Optical Systems and Technologies Keyword: wavelength conversion, cross-phase modulation, ITU-T grid, hybrid integration, polarization insensitive,
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Hybrid External Cavity Lasers Composed of Spot-Size Converter Integrated LDs and UV Written Bragg Gratings in a Planar Lightwave Circuit on Si Takuya TANAKA Hiroshi TAKAHASHI Yoshinori HIBINO Toshikazu HASHIMOTO Akira HIMENO Yasufumi YAMADA Yuichi TOHMORI
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2000/06/20 Vol. E83-C No. 6 pp. 875-883 Type of Manuscript: Special Section PAPER (Special Issue on Advanced Optical Devices for Next Generation High-Speed Communication Systems and Photonic Networks) Category: WDM Network Devices Keyword: external cavity laser, hybrid integration, grating, multiwavelength laser, PLC,
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A 1.55-µm Hybrid Integrated Wavelength-Converter Module Using Spot-Size Converter Integrated Semiconductor Optical Amplifiers on a Planar-Lightwave-Circuit Platform Rieko SATO Yasuhiro SUZUKI Naoto YOSHIMOTO Ikuo OGAWA Toshikazu HASHIMOTO Toshio ITO Akio SUGITA Yuichi TOHMORI Hiromu TOBA
Publication: IEICE TRANSACTIONS on Communications Publication Date: 1999/08/20 Vol. E82-B No. 8 pp. 1221-1227 Type of Manuscript: Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications) Category: Optical Active Devices and Modules Keyword: hybrid integration, spot-size converter integrated semiconductor optical amplifier, planar-lightwave-circuit platform, wavelength conversion, temperature dependence,
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1.3/1.55-µm Full-Duplex WDM Optical Transceiver Modules for ATM-PON (PDS) Systems Using PLC-Hybrid-Integration and CMOS-IC Technologies Takeshi KUROSAKI Toshikazu HASHIMOTO Noboru ISHIHARA Yasuhiro SUZUKI Masahiro YANAGISAWA Hideaki KIMURA Makoto NAKAMURA Yuichi TOHMORI Kazutoshi KATO Yoshihiro KAWAGUCHI Yuji AKAHORI Yasufumi YAMADA Kuniharu KATO Hiromu TOBA Junichi YOSHIDA
Publication: IEICE TRANSACTIONS on Communications Publication Date: 1999/08/20 Vol. E82-B No. 8 pp. 1199-1208 Type of Manuscript: Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications) Category: Optical Active Devices and Modules Keyword: optical transceiver module, PLC, hybrid integration, CMOS IC, ATM PON, full-duplex operation,
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A 1.55-µm Hybrid Integrated Wavelength-Converter Module Using Spot-Size Converter Integrated Semiconductor Optical Amplifiers on a Planar-Lightwave-Circuit Platform Rieko SATO Yasuhiro SUZUKI Naoto YOSHIMOTO Ikuo OGAWA Toshikazu HASHIMOTO Toshio ITO Akio SUGITA Yuichi TOHMORI Hiromu TOBA
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1999/08/20 Vol. E82-C No. 8 pp. 1487-1493 Type of Manuscript: Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications) Category: Optical Active Devices and Modules Keyword: hybrid integration, spot-size converter integrated semiconductor optical amplifier, planar-lightwave-circuit platform, wavelength conversion, temperature dependence,
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1.3/1.55-µm Full-Duplex WDM Optical Transceiver Modules for ATM-PON (PDS) Systems Using PLC-Hybrid-Integration and CMOS-IC Technologies Takeshi KUROSAKI Toshikazu HASHIMOTO Noboru ISHIHARA Yasuhiro SUZUKI Masahiro YANAGISAWA Hideaki KIMURA Makoto NAKAMURA Yuichi TOHMORI Kazutoshi KATO Yoshihiro KAWAGUCHI Yuji AKAHORI Yasufumi YAMADA Kuniharu KATO Hiromu TOBA Junichi YOSHIDA
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1999/08/20 Vol. E82-C No. 8 pp. 1465-1474 Type of Manuscript: Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications) Category: Optical Active Devices and Modules Keyword: optical transceiver module, PLC, hybrid integration, CMOS IC, ATM PON, full-duplex operation,
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Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs) Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1999/02/20 Vol. E82-C No. 2 pp. 370-378 Type of Manuscript: Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices) Category: Assembly and Packaging Technologies Keyword: PLC platform, hybrid integration, solder bump, flip-chip bonding, microstrip line,
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Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs) Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO
Publication: IEICE TRANSACTIONS on Communications Publication Date: 1999/02/20 Vol. E82-B No. 2 pp. 422-430 Type of Manuscript: Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices) Category: Assembly and Packaging Technologies Keyword: PLC platform, hybrid integration, solder bump, flip-chip bonding, microstrip line,
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High Responsivity, Low Dark Current, and Highly Reliable Operation of InGaAlAs Waveguide Photodiodes for Optical Hybrid Integration Hitoshi NAKAMURA Masato SHISHIKURA Shigehisa TANAKA Yasunobu MATSUOKA Tsunao ONO Takao MIYAZAKI Shinji TSUJI
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1997/01/20 Vol. E80-C No. 1 pp. 41-46 Type of Manuscript: Special Section PAPER (Special Issue on Devices, Packaging Technology, and Subsystems for the Optical Access Network) Category: Keyword: optical access, optical platform, hybrid integration, planar lightwave circuit, waveguide photodiode, photodiode, molecular beam epitaxy, passivation, reliability,
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Low-Cost Hybrid WDM Module Consisting of a Spot-Size Converter Integrated Laser Diode and a Waveguide Photodiode on a PLC Platform for Access Network Systems Naoto UCHIDA Yasufumi YAMADA Yoshinori HIBINO Yasuhiro SUZUKI Noboru ISHIHARA
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1997/01/20 Vol. E80-C No. 1 pp. 88-97 Type of Manuscript: INVITED PAPER (Special Issue on Devices, Packaging Technology, and Subsystems for the Optical Access Network) Category: Module and packaging technology Keyword: optical module, hybrid integration, planar lightwave circuit, large spot-size laser diode, passive alignment, access network,
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