Keyword : heterogeneous integration


Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method
Eiji HIGURASHI Ken OKUMURA Yutaka KUNIMUNE Tadatomo SUGA Kei HAGIWARA 
Publication:   
Publication Date: 2017/02/01
Vol. E100-C  No. 2 ; pp. 156-160
Type of Manuscript:  INVITED PAPER (Special Section on Fabrication Technologies Supporting the Photonic/Nanostructure Devices)
Category: 
Keyword: 
heterogeneous integrationroom-temperature bondingsurface-activated bondingAu-Au bonding
 Summary | Full Text:PDF(1019.2KB)

Room-Temperature Gold-Gold Bonding Method Based on Argon and Hydrogen Gas Mixture Atmospheric-Pressure Plasma Treatment for Optoelectronic Device Integration
Eiji HIGURASHI Michitaka YAMAMOTO Takeshi SATO Tadatomo SUGA Renshi SAWADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2016/03/01
Vol. E99-C  No. 3 ; pp. 339-345
Type of Manuscript:  INVITED PAPER (Special Section on Progress towards System Nanotechnology)
Category: 
Keyword: 
heterogeneous integrationlow-temperature bondingsurface-activated bondingatmospheric-pressure plasmaoptical microsystems
 Summary | Full Text:PDF(1.3MB)

Fabrication of InP/InGaAs SHBT on Si Substrate by Using Transferred Substrate Process
Yutaro YAMAGUCHI Takeshi SAGAI Yasuyuki MIYAMOTO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/08/01
Vol. E95-C  No. 8 ; pp. 1323-1326
Type of Manuscript:  BRIEF PAPER
Category: III-V High-Speed Devices and Circuits
Keyword: 
heterojunction bipolar transistorInPbase-collector capacitancetransferred-substrateheterogeneous integration
 Summary | Full Text:PDF(619.5KB)

A GaAs SOI HEMT Fabricated by Fluidic Self-Assembly and Its Application to an RF-Switch
Koichi MAEZAWA Ikuo SOGA Shigeru KISHIMOTO Takashi MIZUTANI Kazuhiro AKAMATSU 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2008/07/01
Vol. E91-C  No. 7 ; pp. 1025-1030
Type of Manuscript:  Special Section PAPER (Special Section on Heterostructure Microelectronics with TWHM 2007)
Category: Novel Integration Technology
Keyword: 
heterogeneous integrationfluidic self-assemblyHEMTSPDT switchSOI
 Summary | Full Text:PDF(1.5MB)

Field Configurable Self-Assembly: A New Heterogeneous Integration Technology
Alan O'RIORDAN Gareth REDMOND Thierry DEAN Mathias PEZ 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2003/10/01
Vol. E86-C  No. 10 ; pp. 1977-1984
Type of Manuscript:  INVITED PAPER (Special Issue on Heterostructure Microelectronics with TWHM2003)
Category: 
Keyword: 
heterogeneous integrationself-assemblyprogrammable force fieldscollective wiring
 Summary | Full Text:PDF(857.8KB)