Keyword : flip-chip


High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices
Shigeru KANAZAWA Hiroshi YAMAZAKI Yuta UEDA Wataru KOBAYASHI Yoshihiro OGISO Johsuke OZAKI Takahiko SHINDO Satoshi TSUNASHIMA Hiromasa TANOBE Atsushi ARARATAKE 
Publication:   
Publication Date: 2019/04/01
Vol. E102-C  No. 4 ; pp. 340-346
Type of Manuscript:  INVITED PAPER (Special Section on Progress in Optical Device Technology for Increasing Data Transmission Capacity)
Category: 
Keyword: 
flip-chipEA-DFB laserMach-Zehnder modulatorpackaging
 Summary | Full Text:PDF(1.9MB)

High-Performance 76-GHz Planar Gunn VCO
Yoshimichi FUKASAWA Kiyoshi KAWAGUCHI Takashi YOSHIDA Takahiro SUGIYAMA Atsushi NAKAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2008/07/01
Vol. E91-C  No. 7 ; pp. 1098-1103
Type of Manuscript:  Special Section PAPER (Special Section on Heterostructure Microelectronics with TWHM 2007)
Category: GaAs- and InP-Based Devices
Keyword: 
Gunn VCOflip-chipmillimeter-wavetuning-frequency rangelaser micromachining
 Summary | Full Text:PDF(1MB)

77-GHz MMIC Module Design Techniques for Automotive Radar Applications
Yasushi ITOH Kazuhiko HONJO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2005/10/01
Vol. E88-C  No. 10 ; pp. 1939-1946
Type of Manuscript:  REVIEW PAPER
Category: 
Keyword: 
millimeter-waveMMICmoduleautomotive radar sensorMCMSiPSoCflip-chip
 Summary | Full Text:PDF(1.6MB)

100-GHz Ultra-Broadband Distributed Amplifier in Chip-Size Package
Satoshi MASUDA Kazuhiko KOBAYASHI Hidehiko KIRA Masayuki KITAJIMA Kazukiyo JOSHIN 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2004/07/01
Vol. E87-C  No. 7 ; pp. 1197-1203
Type of Manuscript:  PAPER
Category: Microwaves, Millimeter-Waves
Keyword: 
chip-size package (CSP)distributed amplifierinverted microstrip linegrounded coplanar waveguideflip-chipInP HEMTmillimeter-wavelead-free solder
 Summary | Full Text:PDF(1.4MB)

Development of K-Band Front-End Devices for Broadband Wireless Communication Systems Using Millimeter-Wave Flip-Chip IC Technology
Kazuaki TAKAHASHI Suguru FUJITA Hiroyuki YABUKI Takayuki YOSHIDA Yoshito IKEDA Hiroyuki SAKAI Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C  No. 6 ; pp. 827-833
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword: 
flip-chipmicro bump bondingmillimeter-waveHFETHBT
 Summary | Full Text:PDF(740.2KB)

High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-Wave ICs
Hiroyuki SAKAI Takayuki YOSHIDA Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C  No. 6 ; pp. 810-818
Type of Manuscript:  INVITED PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword: 
flip-chipbumpHIC (Hybrid IC)microwavemillimeter-wave
 Summary | Full Text:PDF(1.2MB)

A Novel Millimeter-Wave IC on Si Substrate Using Flip-Chip Bonding Technology
Hiroyuki SAKAI Yorito OTA Kaoru INOUE Takayuki YOSHIDA Kazuaki TAKAHASHI Suguru FUJITA Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/08/25
Vol. E78-C  No. 8 ; pp. 971-978
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology)
Category: 
Keyword: 
millimeter-waveflip-chipIC (Integrated Circuit)microstrip linebump
 Summary | Full Text:PDF(1MB)