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Keyword : flip-chip

High-Performance 76-GHz Planar Gunn VCO Yoshimichi FUKASAWA Kiyoshi KAWAGUCHI Takashi YOSHIDA Takahiro SUGIYAMA Atsushi NAKAGAWA
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2008/07/01 Vol. E91-C No. 7 pp. 1098-1103 Type of Manuscript: Special Section PAPER (Special Section on Heterostructure Microelectronics with TWHM 2007) Category: GaAs- and InP-Based Devices Keyword: Gunn VCO, flip-chip, millimeter-wave, tuning-frequency range, laser micromachining,
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77-GHz MMIC Module Design Techniques for Automotive Radar Applications Yasushi ITOH Kazuhiko HONJO
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2005/10/01 Vol. E88-C No. 10 pp. 1939-1946 Type of Manuscript: REVIEW PAPER Category: Keyword: millimeter-wave, MMIC, module, automotive radar sensor, MCM, SiP, SoC, flip-chip,
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100-GHz Ultra-Broadband Distributed Amplifier in Chip-Size Package Satoshi MASUDA Kazuhiko KOBAYASHI Hidehiko KIRA Masayuki KITAJIMA Kazukiyo JOSHIN
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2004/07/01 Vol. E87-C No. 7 pp. 1197-1203 Type of Manuscript: PAPER Category: Microwaves, Millimeter-Waves Keyword: chip-size package (CSP), distributed amplifier, inverted microstrip line, grounded coplanar waveguide, flip-chip, InP HEMT, millimeter-wave, lead-free solder,
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High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-Wave ICs Hiroyuki SAKAI Takayuki YOSHIDA Morikazu SAGAWA
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1998/06/20 Vol. E81-C No. 6 pp. 810-818 Type of Manuscript: INVITED PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology) Category: Functional Modules and the Design Technology Keyword: flip-chip, bump, HIC (Hybrid IC), microwave, millimeter-wave,
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Development of K-Band Front-End Devices for Broadband Wireless Communication Systems Using Millimeter-Wave Flip-Chip IC Technology Kazuaki TAKAHASHI Suguru FUJITA Hiroyuki YABUKI Takayuki YOSHIDA Yoshito IKEDA Hiroyuki SAKAI Morikazu SAGAWA
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1998/06/20 Vol. E81-C No. 6 pp. 827-833 Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology) Category: Functional Modules and the Design Technology Keyword: flip-chip, micro bump bonding, millimeter-wave, HFET, HBT,
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A Novel Millimeter-Wave IC on Si Substrate Using Flip-Chip Bonding Technology Hiroyuki SAKAI Yorito OTA Kaoru INOUE Takayuki YOSHIDA Kazuaki TAKAHASHI Suguru FUJITA Morikazu SAGAWA
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1995/08/20 Vol. E78-C No. 8 pp. 971-978 Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology) Category: Keyword: millimeter-wave, flip-chip, IC (Integrated Circuit), microstrip line, bump,
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