Keyword : flip chip

Reliability of Microbumps Interconnect for 3D TSV Chip Stacking
Yasumitsu ORII  Katsuyuki SAKUMA  Kuniaki SUEOKA  Sayuri KOHARA  Kazushige TORIYAMA  Keiji MATSUMOTO  Hirokazu NOMA  Keishi OKAMOTO  Toyohiro AOKI 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2011/11/01
Vol. J94-C  No. 11  pp. 402-410
Type of Manuscript: Special Section PAPER (Special Issue on High-speed & High-density Packaging and Integration Technologies for Microelectronic Devices)
Category: 
Keyword: 
IMC bonding,  CPI (Chip Package Interaction),  flip chip,  chip stack, 
  Summary |  Full Text(in Japanese):PDF (1.9MB)
Current Barriers and Future Direction of Semiconductor Packaging with Flip Chip Bonding
Yutaka TSUKADA  Kimihiro YAMANAKA  Takayuki NEJIME 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2008/11/01
Vol. J91-C  No. 11  pp. 509-518
Type of Manuscript: Special Section PAPER (Special Issue on Leading-Edge Trend of Advanced Packages for Electron Devices and Its Related Topics for High-Density Packaging Process Technologies)
Category: 
Keyword: 
flip chip,  build-up substrate,  bumping,  lead free, 
  Summary |  Full Text(in Japanese):PDF (1.2MB)