Keyword : electroless plating

Electroless Barrier/Seed Plating for Cu-TSV Using Au Nanoparticles
Fumihiro INOUE  Tomohiro SHIMIZU  Kazuo KONDO  Taro HAYASHI  Shoso SHINGUBARA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2011/11/01
Vol. J94-C  No. 11  pp. 386-393
Type of Manuscript: Special Section PAPER (Special Issue on High-speed & High-density Packaging and Integration Technologies for Microelectronic Devices)
Category: 
Keyword: 
TSV,  Cu interconnect,  electroless plating,  difussion barrier,  seed layer, 
  Summary |  Full Text(in Japanese):PDF (2.2MB)
Pressureless Flip-Chip Bonding Method Using Electroless Plating
Yasuhiro YAMAJI  Tokihiko YOKOSHIMA  Noboru IGAWA  Yuichiro TAMURA  Katsuya KIKUCHI  Hiroshi NAKAGAWA  Masahiro AOYAGI 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2008/11/01
Vol. J91-C  No. 11  pp. 595-602
Type of Manuscript: Special Section PAPER (Special Issue on Leading-Edge Trend of Advanced Packages for Electron Devices and Its Related Topics for High-Density Packaging Process Technologies)
Category: 
Keyword: 
flip chip bonding,  electroless plating,  pressureless,  low temperature, 
  Summary |  Full Text(in Japanese):PDF (2.1MB)