Keyword : bonding

Reduction of Access Resistance of InP/InGaAs Composite-Channel MOSFET with Back-Source Electrode
Atsushi KATO  Toru KANAZAWA  Shunsuke IKEDA  Yoshiharu YONAI  Yasuyuki MIYAMOTO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/05/01
Vol. E95-C  No. 5  pp. 904-909
Type of Manuscript: Special Section PAPER (Special Section on Fundamentals and Applications of Advanced Semiconductor Devices)
Category: 
Keyword: 
back-source,  MOSFET,  InGaAs,  BCB,  bonding, 
  Summary |  Full Text:PDF (1.8MB)
Microassembly System for Integration of MEMS Using the Surface Activated Bonding Method
Tadatomo SUGA  Yuzo ISHII  Naoe HOSODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/02/20
Vol. E80-C  No. 2  pp. 297-302
Type of Manuscript: Special Section PAPER (Special Issue on Micromachine Technology)
Category: Fabrication
Keyword: 
bonding,  surface activated bonding,  assembly,  micro-system,  integration,  MEMS,  micromachine,  WWW, 
  Summary |  Full Text:PDF (1.1MB)