Keyword : backside LSI package lead inspection system


Automatic LSI Package Lead Inspection System with CCD Camera for Backside Lead Specification
Wataru TAMAMURA Koji NAKAMAE Hiromu FUJIOKA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2003/04/01
Vol. E86-C  No. 4 ; pp. 661-667
Type of Manuscript:  PAPER
Category: Integrated Electronics
Keyword: 
backside LSI package lead inspection systemimage processingQFP packageline-scan CCD camera
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