Keyword : SiP


A 60 GHz-Band 3-Dimensional System-in-Package Transmitter Module with Integrated Antenna
Noriharu SUEMATSU Satoshi YOSHIDA Shoichi TANIFUJI Suguru KAMEDA Tadashi TAKAGI Kazuo TSUBOUCHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/07/01
Vol. E95-C  No. 7 ; pp. 1141-1146
Type of Manuscript:  INVITED PAPER (Special Section on Recent Trends of Microwave Systems and Their Fundamental Technologies)
Category: 
Keyword: 
moduleRFICMMICantenna integrationmillimeter-waveSiPstud bump
 Summary | Full Text:PDF(6.8MB)

Analysis of Inductive Coupling and Design of Rectifier Circuit for Inter-Chip Wireless Power Link
Yuxiang YUAN Yoichi YOSHIDA Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2010/02/01
Vol. E93-C  No. 2 ; pp. 164-171
Type of Manuscript:  PAPER
Category: Electronic Circuits
Keyword: 
wireless power linkwireless power deliveryinductive-couplinginductorrectifierSiP
 Summary | Full Text:PDF(1.2MB)

Constant Magnetic Field Scaling in Inductive-Coupling Data Link
Daisuke MIZOGUCHI Noriyuki MIURA Hiroki ISHIKURO Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2008/02/01
Vol. E91-C  No. 2 ; pp. 200-205
Type of Manuscript:  PAPER
Category: Electronic Circuits
Keyword: 
inductive couplingconstant magnetic fieldlow powerhigh data rateSiP
 Summary | Full Text:PDF(701.9KB)

77-GHz MMIC Module Design Techniques for Automotive Radar Applications
Yasushi ITOH Kazuhiko HONJO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2005/10/01
Vol. E88-C  No. 10 ; pp. 1939-1946
Type of Manuscript:  REVIEW PAPER
Category: 
Keyword: 
millimeter-waveMMICmoduleautomotive radar sensorMCMSiPSoCflip-chip
 Summary | Full Text:PDF(1.6MB)

µI/O Architecture: A Power-Aware Interconnect Circuit Design for SoC and SiP
Yusuke KANNO Hiroyuki MIZUNO Nobuhiro OODAIRA Yoshihiko YASU Kazumasa YANAGISAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2004/04/01
Vol. E87-C  No. 4 ; pp. 589-597
Type of Manuscript:  Special Section PAPER (Special Section on Low-Power System LSI, IP and Related Technologies)
Category: 
Keyword: 
low-costSystem-on-ChipSoCSystem-in-PackageSiPhierarchical I/O designsignal-level convertersignal wall functionlow-powerinterconnect circuit
 Summary | Full Text:PDF(967.2KB)