Keyword : RF CMOS


A 280-MHz CMOS Intra-Symbol Intermittent RF Front End for Adaptive Power Reduction of Wireless Receivers According to Received-Signal Intensity in Sensor Networks
Mitsuo NAKAMURA Mamoru UGAJIN Mitsuru HARADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2013/01/01
Vol. E96-C  No. 1 ; pp. 93-101
Type of Manuscript:  PAPER
Category: Electronic Circuits
Keyword: 
intra-symbol intermittentRF front endlow powerwireless receiverRF CMOSsensor network
 Summary | Full Text:PDF(2.7MB)

A De-Embedding Method Using Different-Length Transmission Lines for mm-Wave CMOS Device Modeling
Naoki TAKAYAMA Kota MATSUSHITA Shogo ITO Ning LI Keigo BUNSEN Kenichi OKADA Akira MATSUZAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2010/06/01
Vol. E93-C  No. 6 ; pp. 812-819
Type of Manuscript:  Special Section PAPER (Special Section on Analog Circuits and Related SoC Integration Technologies)
Category: 
Keyword: 
de-embeddingS-parameter measurementmm-waveRF CMOStransmission line
 Summary | Full Text:PDF(3.3MB)

Challenges in Designing CMOS Wireless Systems-on-a-Chip
Masoud ZARGARI David SU 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2007/06/01
Vol. E90-C  No. 6 ; pp. 1142-1148
Type of Manuscript:  INVITED PAPER (Special Section on Analog Circuits and Related SoC Integration Technologies)
Category: 
Keyword: 
wireless system on-a-chip (SoC)RF CMOSwireless LAN (WLAN) transceiversIEEE 802.11b/glow-noise amplifiers (LNAs)power amplifiers (PAs)
 Summary | Full Text:PDF(673.7KB)

Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology
Hiroyuki ITO Hideyuki SUGITA Kenichi OKADA Tatsuya ITO Kazuhisa ITOI Masakazu SATO Ryozo YAMAUCHI Kazuya MASU 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2007/03/01
Vol. E90-C  No. 3 ; pp. 641-643
Type of Manuscript:  LETTER
Category: Microwaves, Millimeter-Waves
Keyword: 
wafer-level chip scale packageRF CMOSpassive device
 Summary | Full Text:PDF(290KB)