C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)

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Online ISSN : 1881-0217
Volume J101-C No.2  (Publication Date:2018/02/01)
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Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices

pp.50-57  INVITED PAPER  Open Access Paper
3D Integration Technology for High Performance Car-electronics Sensors
Yuki OHARA  Taku SUZUKI  Yuki INAGAKI  Atsushi MIZUTANI  Kazushi ASAMI  
Summary | FreeFull Text(in Japanese):PDF(2MB)

pp.58-65  PAPER
Development of Evaluation Method of TSV Sidewall Interface Using Multi-well-structured TSV
Yohei SUGAWARA  Hisashi KINO  Takafumi FUKUSHIMA  Tetsu TANAKA  
Summary | Full Text(in Japanese):PDF (1.6MB) >>Buy this Article

pp.66-73  PAPER
Examination of TMV First Process for FO-WLP with Cu Pillar Substrate
Hiroshi YAMADA  Akihiko HAPPOYA  Shuzo AKEJIMA  Hirokazu EZAWA  
Summary | Full Text(in Japanese):PDF (4.3MB) >>Buy this Article

pp.74-82  PAPER
Evaluation of Temperature Dependence of Local Stress and CMOS Circuit Properties in Three-Dimensional LSI Design
Shoichi MIYAHARA  Hideki KITADA  Hiroko TASHIRO  Aki DOTE  Seiki SAKUYAMA  
Summary | Full Text(in Japanese):PDF (1.2MB) >>Buy this Article

pp.83-90  PAPER
Electrical Properties of 2.1-D Organic Interposer Using Photosensitive Film
Yutaka UEMATSU  Nobuyuki USHIFUSA  Hitoshi ONOZEKI  
Summary | Full Text(in Japanese):PDF (2.1MB) >>Buy this Article

pp.91-98  PAPER
PIM-source Identification in Non-contact PIM Measurements of Ultra-fine Coaxial Lines with Mating Coaxial Connectors
Soudai HARA  Nobuhiro KUGA  
Summary | Full Text(in Japanese):PDF (1.1MB) >>Buy this Article

pp.99-100  LETTER
Simultaneous Measurement of Residual Stress at Interfaces between Die Bonding Paste Resins and Cu-Substrates, and Resins and Ag-Fillers in Semiconductor Packages
Takeshi KAKARA  Atsushi IZUMI  Midori WAKABAYASHI  Dai NAGASHIMA  
Summary | Full Text(in Japanese):PDF (408.5KB) >>Buy this Article

pp.101-102  LETTER
The Influence of Water Absorption of Adhesive Film on Adhesive Film Broken
Keishi FUSE  Shinya TAKYU  
Summary | Full Text(in Japanese):PDF (436.8KB) >>Buy this Article

pp.103-106  LETTER
A Novel Chip Place Process for FO-WLP Using a New Tape Expansion Machine
Masatomo NAKAMURA  Shinya TAKYU  Naoya OKAMOTO  Toshiaki MENJO  
Summary | Full Text(in Japanese):PDF (619.2KB) >>Buy this Article

Regular Section

pp.107-118  INVITED PAPER  Open Access Paper
Transmission of Multiple Mobile Wireless Signals by IF-over-Fiber Technique
Kazuki TANAKA  Byung GON KIM  Takashi KOBAYASHI  Abdelmoula BEKKALI  Shinobu NANBA  Kosuke NISHIMURA  Hoon KIM  Yun C. CHUNG  Masatoshi SUZUKI  
Summary | FreeFull Text(in Japanese):PDF(1.7MB)

pp.119-123  LETTER
Asymmetric Hysteresis Current-Voltage Characteristics of Al/Al2O3/Cu2Se/Au Diodes
Yoshinori EMA  Mantaro OGAWA  Takahiro TAKAHASHI  
Summary | Full Text(in Japanese):PDF (687.3KB) >>Buy this Article

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