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C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)

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Online ISSN : 1881-0217

Volume J94-C No.11 (Publication Date:2011/11/01)

Special Issue on High-speed & High-density Packaging and Integration Technologies for Microelectronic Devices

pp.355-364 PAPER 3D Integration Technology and Heterogeneous Integration Mitsumasa KOYANAGI Takafumi FUKUSHIMA Kangwook LEE Tetsu TANAKA
	Summary \| Full Text(in Japanese):PDF (3.3MB)

pp.365-371 PAPER Emergency Issue of Concurrent Design for High Speed LSI and Packaging Kanji OTSUKA
	Summary \| Full Text(in Japanese):PDF (1MB)

pp.372-379 PAPER High Speed and High Accuracy Flip-Chip Bonding Technology Using Microbumps Katsumi TERADA Mikio KAWAKAMI
	Summary \| Full Text(in Japanese):PDF (1.8MB)

pp.380-385 PAPER Advanced Trench Filling Process by Selective Copper Electrodeposition for Ultra Fine Printed Wiring Board Fabrication Hiroshi NAKANO Hitoshi SUZUKI Toshio HABA Hiroshi YOSHIDA Akira CHINDA Haruo AKAHOSHI
	Summary \| Full Text(in Japanese):PDF (634.9KB)

pp.386-393 PAPER Electroless Barrier/Seed Plating for Cu-TSV Using Au Nanoparticles Fumihiro INOUE Tomohiro SHIMIZU Kazuo KONDO Taro HAYASHI Shoso SHINGUBARA
	Summary \| Full Text(in Japanese):PDF (2.2MB)

pp.394-401 PAPER High Density Cu/Sn Microbump Formation Using EEB (Electroplating and Evaporation Bumping) Technology for High Performance Three Dimensional Integration Yuki OHARA Akihiro NORIKI Kang-Wook LEE Takafumi FUKUSHIMA Tetsu TANAKA Mitsumasa KOYANAGI
	Summary \| Full Text(in Japanese):PDF (1.4MB)

pp.402-410 PAPER Reliability of Microbumps Interconnect for 3D TSV Chip Stacking Yasumitsu ORII Katsuyuki SAKUMA Kuniaki SUEOKA Sayuri KOHARA Kazushige TORIYAMA Keiji MATSUMOTO Hirokazu NOMA Keishi OKAMOTO Toyohiro AOKI
	Summary \| Full Text(in Japanese):PDF (1.9MB)

pp.411-418 PAPER Impacts of Bending Stress on MOSFET Characteristics by LSI Stacking for 3D-LSI Hisashi KINO Mariappan MURUGESAN Toshiya KOJIMA Takafumi FUKUSHIMA Tetsu TANAKA Mitsumasa KOYANAGI
	Summary \| Full Text(in Japanese):PDF (1.7MB)

pp.419-426 PAPER Study of Stress to Solder Joint by Underfill Filling Akira TANAKA Akihiko HAPPOYA Shun OKAYAMA
	Summary \| Full Text(in Japanese):PDF (1.7MB)

pp.427-432 PAPER Hermetic Sealing Technology for Micro-Devices Using Printing of No-Clean Lead-Free Solder Paste and Reflow with Hydrogen-Radical Treatment Hiroki OSHIKAWA Shinichi YAMAMOTO Eiji HIGURASHI Tadatomo SUGA Sakie OKADA
	Summary \| Full Text(in Japanese):PDF (632.2KB)

pp.433-440 PAPER Micro Mirror Arrays for Improved Sensitivity of Thermopile Infrared Sensors Makoto OHIRA Makoto MORIGUCHI Sho SASAKI Masatoshi OBA Tomoyuki TAKAHATA Isao SHIMOYAMA Masafumi KIMATA
	Summary \| Full Text(in Japanese):PDF (1.3MB)

pp.441-447 PAPER Applications of Si Microchannel Cooler to High Power Amplifiers for Base Station of Mobile Communication Systems Yoshihiro MIZUNO Ikuo SOGA Shinichi HIROSE Osamu TSUBOI Taisuke IWAI
	Summary \| Full Text(in Japanese):PDF (1.1MB)

pp.448-457 PAPER Detecting Noise Sources with Time Series Analysis Akira SHOJIGUCHI Manabu KUSUMOTO Takashi HARADA
	Summary \| Full Text(in Japanese):PDF (1.7MB)

pp.458-469 PAPER A Method of Extracting an EMC Macro-Model LECCS-Core from a Time-Variant Linear Equivalent Circuit of a CMOS LSI Hiroshi TANAKA Tohlu MATSUSHIMA Takashi HISAKADO Osami WADA
	Summary \| Full Text(in Japanese):PDF (1.1MB)

pp.470-471 LETTER Low-Temperature Bonding of Laser Diode Chips Using Au Stud Bumps Takeshi SATO Eiji HIGURASHI Tadatomo SUGA Renshi SAWADA
	Summary \| Full Text(in Japanese):PDF (561.3KB)

pp.472-475 LETTER 3D Module Structure and Laser Diode Driver with Mutually Coupled Inductors for 20 Gbit/s Optical Transmitter Module Toshiaki TAKAI Norio CHUJO Saori HAMAMURA Daichi KAWAMURA Yasunobu MATSUOKA Kouichirou ADACHI Toshiki SUGAWARA Tsuneo KAWAMATA Toshinobu OHNO Kenichi OHHATA
	Summary \| Full Text(in Japanese):PDF (1MB)