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C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)

Archive Index

Online ISSN : 1881-0217

Volume J91-C No.11 (Publication Date:2008/11/01)

Special Issue on Leading-Edge Trend of Advanced Packages for Electron Devices and Its Related Topics for High-Density Packaging Process Technologies

pp.509-518 PAPER Current Barriers and Future Direction of Semiconductor Packaging with Flip Chip Bonding Yutaka TSUKADA Kimihiro YAMANAKA Takayuki NEJIME
	Summary \| Full Text(in Japanese):PDF (1.2MB)

pp.519-526 PAPER Cu Bumpless Interconnect by SAB at Room Temperature and 3D Integration Todatomo SUGA
	Summary \| Full Text(in Japanese):PDF (3.3MB)

pp.527-533 PAPER Wafer Level Packaging of MEMS Masayoshi ESASHI
	Summary \| Full Text(in Japanese):PDF (921.4KB)

pp.534-541 PAPER Low Temperature Sn-Bi Soldering Tecnology for Low Stress Packaging Seiki SAKUYAMA Toshiya AKAMATSU Keisuke UENISHI Takehiko SATO
	Summary \| Full Text(in Japanese):PDF (1.4MB)

pp.542-551 PAPER Through-Silicon Via Interconnection for 3D Integration Using Room-Temperature Bonding Naotaka TANAKA Yasuhiro YOSHIMURA Michihiro KAWASHITA Takahiro NAITO Toshihide UEMATSU Chuichi MIYAZAKI Norihisa TOMA Kenji HANADA Masaki NAKANISHI Takafumi KIKUCHI Takashi AKAZAWA
	Summary \| Full Text(in Japanese):PDF (2.4MB)

pp.552-558 PAPER Signal-to-Noise Ratio Measurements of Mixed-Signal System-in-Package (SiP) Hideki SASAKI Yuki FUJIMURA Tomoo MURAKAMI Hiroyuki TERAI
	Summary \| Full Text(in Japanese):PDF (874.9KB)

pp.559-568 PAPER High Accuracy Modeling Method for High Density and Multi-Functional Packages Toru YAMADA Masahiro YAMAOKA Kazuhide URIU Ken-ya HASHIMOTO Masatsune YAMAGUCHI
	Summary \| Full Text(in Japanese):PDF (1.9MB)

pp.569-576 PAPER Evaluation of an Interposer Embedded Capacitors for a System LSI Yoshiyuki SAITO Eiji TAKAHASHI Chie SASAKI Yasuhiro SUGAYA
	Summary \| Full Text(in Japanese):PDF (1012.1KB)

pp.577-585 PAPER Productivity and Reliability of Module Using Substrate with Cavity Akihiko HAPPOYA Jun KARASAWA Daigo SUZUKI Koji SHINGUU Kenji HIROHATA Shun OKAYAMA
	Summary \| Full Text(in Japanese):PDF (1.4MB)

pp.586-594 PAPER High-Density Integration of Dissimilar Materials by Epifilm Bonding Technology Mitsuhiko OGIHARA Hiroyuki FUJIWARA Takahito SUZUKI Tomoki IGARI Seiji MORISAKI Masaaki SAKUTA
	Summary \| Full Text(in Japanese):PDF (1.1MB)

pp.595-602 PAPER Pressureless Flip-Chip Bonding Method Using Electroless Plating Yasuhiro YAMAJI Tokihiko YOKOSHIMA Noboru IGAWA Yuichiro TAMURA Katsuya KIKUCHI Hiroshi NAKAGAWA Masahiro AOYAGI
	Summary \| Full Text(in Japanese):PDF (2.1MB)

pp.603-609 PAPER Novel Dicing Technologies for Thin Chips Realizing High Chip Strength Shinya TAKYU Tetsuya KUROSAWA Noriko SHIMIZU Susumu HARADA
	Summary \| Full Text(in Japanese):PDF (483.9KB)

pp.610-616 PAPER Development of Optical Integrated Chip Using Si Microlens Ryo SEKIKAWA Daisuke SHIMURA Masahiro UEKAWA Hironori SASAKI Kazutoshi KOMATSU Teijiro ORI
	Summary \| Full Text(in Japanese):PDF (1.8MB)

pp.617-626 PAPER High-Density Mounting of Piezoresistive Pressure Sensors Using Reticle Free Exposure Method for Suppressing Fluctuation of Sensitivity Yuki SOH Naoki HAYASHI Taishi ENDO Katsuhiko WAKASUGI Takeshi ICHIKAWA Shigeyuki MATSUMOTO Hiroshi KUBOTA
	Summary \| Full Text(in Japanese):PDF (922.3KB)

pp.627-634 PAPER Real-Time Observation of Lead-Free Solder Reflow Process Using Hydrogen Plasma and Determination of Reflow Profile Eiji HIGURASHI Shuichi NISHI Tadatomo SUGA Taizoh HAGIHARA Tatsuya TAKEUCHI Sakie YAMAGATA Rikiya KATO
	Summary \| Full Text(in Japanese):PDF (1.2MB)

pp.635-644 PAPER Quality Improvement of GaAs Chips Die-Bonding Using AuSn Solder with Interface Reaction Control Junji FUJINO Masayasu ITO Hiroo SAKAMOTO Akiyoshi SAWAI Kozo FUJIMOTO
	Summary \| Full Text(in Japanese):PDF (1.8MB)

pp.645-651 PAPER Improvement of the Maximum Heat Flux by Applying Zeotropic Coolant Mixtures Kishio YOKOUCHI Keisuke UENISHI Takehiko SATO
	Summary \| Full Text(in Japanese):PDF (596.3KB)

Regular Section

pp.652-657 PAPER Miniaturization of Broadband Branch-Line Couplers by Using Divided-Transmission Lines Fumio TAKEDA
	Summary \| Full Text(in Japanese):PDF (540.8KB)

pp.658-665 PAPER 4-12 GHz Cryogenic Low-Noise HEMT Amplifier Takafumi KOJIMA Yasuhiro ABE Hideo OGAWA
	Summary \| Full Text(in Japanese):PDF (645KB)

pp.666-667 LETTER Study for Reading Method of Stacked NAND Type MRAM Using Spin Transistor Shoto TAMAI Shigeyoshi WATANABE
	Summary \| Full Text(in Japanese):PDF (144.4KB)

pp.668-669 LETTER Reading Method of NAND Type 1-Transistor FeRAM with Pulse Input Koichi SUGANO Shigeyoshi WATANABE
	Summary \| Full Text(in Japanese):PDF (353KB)