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C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)

Archive Index

Online ISSN : 1881-0217

Volume J90-C No.11 (Publication Date:2007/11/01)

Special Issue on Next Generation High Density Packaging Materials Technology for High Performance Electric Systems

pp.699-706 PAPER Packaging Technology for Environment-Conscious Era Nobuo KAMEHARA
	Summary \| Full Text(in Japanese):PDF (2.1MB)

pp.707-713 PAPER Assessment Test for Solder Joint Reliability in Mobile Products Masazumi AMAGAI
	Summary \| Full Text(in Japanese):PDF (2MB)

pp.714-723 PAPER Development of Low Temperature MCL Technology by Using Indium Bump Satoru WAKIYAMA Hiroshi OZAKI Yoshihiro NABE Tomomi KUME Takayuki EZAKI Tohru OGAWA
	Summary \| Full Text(in Japanese):PDF (1.7MB)

pp.724-733 PAPER Development of High-Density Package for Stacked DRAM Using Through-Silicon Vias Masaya KAWANO Nobuaki TAKAHASHI Yoichiro KURITA Koji SOEJIMA Masahiro KOMURO Satoshi MATSUI Shiro UCHIYAMA Kayoko SHIBATA Junji YAMADA Masakazu ISHINO Hiroaki IKEDA Yoshimi EGAWA Yoshihiro SAEKI Osamu KATO Hidekazu KIKUCHI Azusa YANAGISAWA Toshiro MITSUHASHI
	Summary \| Full Text(in Japanese):PDF (4MB)

pp.734-740 PAPER Fine-Pitch Multilayer Wiring Technology for Packages Using Via Posts and Grinding Planarization Motoaki TANI Kanae NAKAGAWA Masataka MIZUKOSHI Masayuki KATO
	Summary \| Full Text(in Japanese):PDF (3.9MB)

pp.741-748 PAPER Development of Three-Dimentional Lithography System for High-Density Packaging Fumito IMURA Kouta HIDAKA Yuki SOH Naoki HAYASHI Masao YOSHIOKA Hiroshi KUBOTA
	Summary \| Full Text(in Japanese):PDF (567KB)

pp.749-756 PAPER Reduction of Power Line Noise Using Embedded Sheet Capacitor in Printed Circuit Board Seiji KARASHIMA Hiroki YABE
	Summary \| Full Text(in Japanese):PDF (797.7KB)

pp.757-766 PAPER 1.3 µm 10-Gbit/s/channel Parallel Transmitter and Receiver Modules Masato SHISHIKURA Takuma BAN Reiko MITA Yasunobu MATSUOKA Kouji NAKAHARA
	Summary \| Full Text(in Japanese):PDF (1.6MB)

pp.767-774 PAPER Proposal of Chip-to-Chip Optical Interconnects Board Using Channel Waveguides with Wavelength-Division Multiplexing Kenji KINTAKA Junji NISHII Satoshi YAMAGUCHI Shogo URA
	Summary \| Full Text(in Japanese):PDF (524.5KB)

pp.775-784 PAPER Optical Interconnection Module Using Ceramic Package as Alignment Arrangement Takeshi OHNO Yutaka TAKAGI Toshikazu HORIO Shigeo KUNDA Atsushi SUZUKI Toshikatsu TAKADA Masahiko OKUYAMA Kazushige OBAYASHI
	Summary \| Full Text(in Japanese):PDF (1.5MB)

pp.785-792 PAPER Self-Written Optical Connection Rod on VCSEL Fabricated by Mask Transfer Method and Its Optical Characteristics Masahiro KANDA Hiroyuki KUBO Yusuke OBATA Yusuke OYAMA Osamu MIKAMI
	Summary \| Full Text(in Japanese):PDF (2.2MB)

pp.793-800 PAPER A Non-destructive Evaluation Method for Connection Reliability of Micro Bump Joints in Three-Dimensionally Stacked Chip Structures Yuki SATO Hideo MIURA
	Summary \| Full Text(in Japanese):PDF (803.5KB)

pp.801-806 PAPER Economy Evaluation of Chip-PKG-Board Function Testing for Multi Pin LSI Packaging Hirobumi INOUE
	Summary \| Full Text(in Japanese):PDF (683.3KB)

pp.807-813 PAPER Reliability Evaluation of Lead Free Solder Joint against Vibration Load under Thermal Circumstance Michiya MATSUSHIMA Toshiyuki HAMANO Kiyokazu YASUDA Kozo FUJIMOTO
	Summary \| Full Text(in Japanese):PDF (753.2KB)

pp.814-817 LETTER Basic Study on Tunable Bandstop Filter Using Shunt Stub and Varactor for DAA in UWB Radio System Yasuhisa YAMAMOTO Keren LI Osamu HASHIMOTO
	Summary \| Full Text(in Japanese):PDF (302.5KB)

pp.818-820 LETTER BIST Circuit Using Double Integrator for D-A Convertor Shinya MATSUMOTO Toshio KOBAYASHI Yasuyuki MATSUYA
	Summary \| Full Text(in Japanese):PDF (222.8KB)