C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)

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Online ISSN : 1881-0217
Volume J101-C No.7  (Publication Date:2018/07/01)
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pp.273-281  PAPER
Sheet-Shape Molding Resin Realizing Low Warpage for Fan-Out Panel Level Package
Kazuhiro KIKUCHI  Yuusuke NEZU  Takashi SUGINO  
Summary | Full Text(in Japanese):PDF (1.4MB) >>Buy this Article

pp.282-286  LETTER
Estimation Discrepancies Associated with Different Calculation Methods between Mode-Matching Technique and Finite-Element Method for Dielectric Measurement in Liquids via the Open-ended Cut-off Circular Waveguide Reflection Method
Kouji SHIBATA  Masaki KOBAYASHI  
Summary | Full Text(in Japanese):PDF (1.4MB) >>Buy this Article

pp.287-289  LETTER
Analytical Study for Electric Resistance of Graphene
Naoto MATSUO  Akira HEYA  
Summary | Full Text(in Japanese):PDF (407.5KB) >>Buy this Article

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