IEICE TRANSACTIONS on Electronics

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Volume E74-C No.8  (Publication Date:1991/08/25)
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Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing

pp.2295-2296  FOREWORD
FOREWORD
Kuniaki TANAKA  
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pp.2297-2300  INVITED PAPER
High Density Packaging Technology Trend in Japan
Fumio MIYASHIRO  
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pp.2301-2308  PAPER-Multi Chip Module
1.8-Gb/s High-Speed Multichip Switching Module Using Copper-Polyimide Multilayer Substrate
Naoaki YAMANAKA  Takaaki OHSAKI  Shiro KIKUCHI  Taichi KON  Shinichi SASAKI  
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pp.2309-2316  PAPER-Multi Chip Module
GaAs Multichip Package for Supercomputer
Kazuhiko UMEZAWA  Tukasa MIZUNO  Hideki NISHIMORI  
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pp.2317-2322  PAPER-Multi Chip Module
Packaging Technology for HEMT LSI Devices Operated in Liquid Nitrogen
Shigenori AOKI  Yoshihiko IMANAKA  Kishio YOKOUCHI  Nobuo KAMEHARA  
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pp.2323-2330  PAPER-Multi Chip Module
A Silicon-Based Multichip Module with Co-Fired Aluminum Nitride Package
Toshio SUDO  Susumu KIMIJIMA  Osamu SHIMADA  Nobuo IWASE  
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pp.2331-2336  PAPER-Packaging Technology for Main Frame
High Performance Packaging Technology for Supercomputers
Toshihiko WATARI  Akihiro DOHYA  
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pp.2337-2343  PAPER-Packaging Technology for Main Frame
LSI Packaging Technology for Mainframe Computers
Kenji TAKEDA  Masahide HARADA  Tsuyoshi FUJITA  Takashi INOUE  
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pp.2344-2348  PAPER-Interconnection
A New Multilayer Ceramic-Frame Package for High-Frequency MMIC Modules
Fuminori ISHITSUKA  Nobuo SATO  Haruhiko KATO  
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pp.2349-2354  PAPER-Interconnection
Thin Package of LSI by Transferred Bump TAB Technology
Tetsuo KAWAKITA  Kenzo HATADA  
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pp.2355-2361  PAPER-Interconnection
A Subminiature CCD Module Using a New Assembly Technique
You KONDOH  Masayuki SAITO  
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pp.2362-2368  PAPER-Interconnection
Flip-Chip Interconnection Technology for Packaging of VLSI Operated in Liquid Nitrogen
Kaoru HASHIMOTO  Masayuki OCHIAI  Kazuaki KARASAWA  Teru NAKANISHI  
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pp.2369-2377  PAPER-Manufacturing Technology
Development of Ultra Fine Wire and Fine Pitch Bonding Technology
Toshimitsu YAMASHITA  Takashi KANAMORI  Yasuo IGUCHI  Yoshinori ARAO  Susumu SHIBATA  Yasuhide OHNO  Yoshio OHZEKI  
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pp.2378-2383  PAPER-Manufacturing Technology
Rheology and Printability of Solder Paste
Shigeyuki OGATA  
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Regular Section

pp.2384-2389  PAPER-Vacuum and Beam Technologies
Data Compaction and Expansion Method for an Electron Beam Direct Writing System Using a Variably Shaped Line Beam
Takayuki ABE  Mineo GOTO  Ryoichi YOSHIKAWA  Susumu WATANABE  Tadahiro TAKIGAWA  
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pp.2390-2397  PAPER-Electromagnetic Theory
Edge-Effect Theory in Mode-Matching Method for the Analysis of Printed-Circuit Waveguides
Mikio TSUJI  Hiroshi SHIGESAWA  
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pp.2398-2409  PAPER-Electromagnetic Theory
Scattering of Electromagnetic Plane Waves by a Grating Composed of Two Arbitrarily Oriented Conducting Strips in One Period
Michinari SHIMODA  Tokuya ITAKURA  
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