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C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)

Archive Index

Online ISSN : 1881-0217

Volume J93-C No.11 (Publication Date:2010/11/01)

Special Section on Advanced Packaging and Its Related Topics about Evaluation and Analysis Technologies for High-Density Packaging

pp.383-387 PAPER Development of Highly Functional Bioplastics (Polylactic Acid Composite) Used for Electronic Products Masatoshi IJI
	Summary \| Full Text(in Japanese):PDF (1.1MB)

pp.388-398 PAPER High Resolution Electrical Measurement Technology for Fine Structures in 3D LSI Chip Stacking Integration Technology Masahiro AOYAGI Katsuya KIKUCHI Motohiro SUZUKI Hiroshi NAKAGAWA
	Summary \| Full Text(in Japanese):PDF (2.1MB)

pp.399-405 PAPER Printed Electronics and Its Materials Technology Katsuaki SUGANUMA Masaya NOGI
	Summary \| Full Text(in Japanese):PDF (948.7KB)

pp.406-413 PAPER Fast Transient Simulation of Plane Distribution Network by Using GPGPU-LIM Yuta INOUE Tadatoshi SEKINE Hideki ASAI
	Summary \| Full Text(in Japanese):PDF (646.3KB)

pp.414-423 PAPER Evaluation of Electrical Characteristics for a High-Pin-Count and Thin Embedded LSI Chip Package Daisuke OHSHIMA Kentaro MORI Yoshiki NAKASHIMA Hideki SASAKI Katsumi KIKUCHI Shintaro YAMAMICHI
	Summary \| Full Text(in Japanese):PDF (2MB)

pp.424-432 PAPER Micro-Noise Design/Verification Technique Development of Chip-Package-Board for Mixed-Signal Systems Mikiko SODE TANAKA Osamu TAKEUCHI Hayato OGAWA Hideki SASAKI Hiroyuki UCHIDA Mituhiro ONO
	Summary \| Full Text(in Japanese):PDF (2.3MB)

pp.433-444 PAPER A Combined IC Macro Model of IBIS and LECCS-Core Models for PI/SI Analyses Norimasa OKA Kengo IOKIBE Yoshitaka TOYOTA Ryuji KOGA
	Summary \| Full Text(in Japanese):PDF (1.7MB)

pp.445-454 PAPER Power Supply Current Analysis of 8-bit Micro-Controller with Considering Program Dependency Yoshiyuki SAITO Katsuya NOMURA Masakatsu YASUHARA Osami WADA
	Summary \| Full Text(in Japanese):PDF (1.3MB)

pp.455-463 PAPER Proposal of Hybrid FPC for 3D-SiP Package Kikuo WADA Ryouji OHSU Shigekazu HINO Nobuyuki YAMASAKI
	Summary \| Full Text(in Japanese):PDF (1.1MB)

pp.464-476 PAPER 3D Large Scale Integration Technology Using Wafer-on-Wafer (WOW) Stacking Takayuki OHBA Nobuhide MAEDA Hideki KITADA Koji FUJIMOTO Akihito KAWAI Kazuhisa ARAI Kosuke SUZUKI Tomoji NAKAMURA
	Summary \| Full Text(in Japanese):PDF (3.7MB)

pp.477-484 PAPER Development of High-Frequency Inductors Using Wafer-Level Packaging Technology and Its Circuit Application Hideki HATAKEYAMA Yusuke UEMICHI Shuhei AMAKAWA Noboru ISHIHARA Kazuya MASU
	Summary \| Full Text(in Japanese):PDF (767.8KB)

pp.485-492 PAPER Microstructure and Mechanical Properties of Sb Addition Eutectic Sn-Bi Solder Seiki SAKUYAMA Toshiya AKAMATSU Keisuke UENISHI Takehiko SATO
	Summary \| Full Text(in Japanese):PDF (1.9MB)

pp.493-502 PAPER High-Precision Chip Alignment Using Self-Assembly Technology for Three-Dimensional Integrated Circuit Applications Eiji IWATA Takafumi FUKUSHIMA Yuki OHRA Kang-wook LEE Tetsu TANAKA Mitsumasa KOYANAGI
	Summary \| Full Text(in Japanese):PDF (2.9MB)

pp.503-508 PAPER Novel MEMS Packaging Technology with Combining STP and Screen-Print Techniques Naruto MAYUMI Mitsuru CHINO Hiroshi TAZAWA Toshikazu KAMEI Katsuyuki MACHIDA Eiji HIGURASHI
	Summary \| Full Text(in Japanese):PDF (510.6KB)

pp.509-515 PAPER Sealing Evaluation of Microdevices Using Resonance Charactaricstics of Cantilevers Vibrated Photothermally Shin-ichi YAMAMOTO Eiji HIGURASHI Tadatomo SUGA Renshi SAWADA
	Summary \| Full Text(in Japanese):PDF (673.9KB)

pp.516-520 PAPER Validation of Multiple Power-Supply-Pin LECCS-core Model for Conducted RF Power Current Simulation Kengo IOKIBE Ryota HIGASHI Takahiro TSUDA Kouji ICHIKAWA Katsumi NAKAMURA Yoshitaka TOYOTA Ryuji KOGA
	Summary \| Full Text(in Japanese):PDF (1.2MB)

pp.521-523 PAPER High-Density (480-Gbit/s/cm²) Optical Printed Circuit Board with an Efficient Optical Interface Yasunobu MATSUOKA Norio CYUJYO Yong LEE Tomoaki SHIBATA Toshiki SUGAWARA
	Summary \| Full Text(in Japanese):PDF (498.2KB)

pp.524-526 PAPER Formation of Fine Wiring Pattern with Laser Assited Ink-Jet Printing Akito ENDO Jun AKEDO
	Summary \| Full Text(in Japanese):PDF (1.3MB)

Regular Section

pp.527-532 PAPER High-Power Pico-Second Vortex Output from a Stressed Large-Mode Area Fiber Amplifier Yuichi TANAKA Mio KOYAMA Masahito OKIDA Katsuhiko MIYAMOTO Takashige OMATSU
	Summary \| Full Text(in Japanese):PDF (617.1KB)

pp.533-534 LETTER A Basic Study of a Diplexer Using a Wide-Band LTCC Filter with Attenuation Poles and a SAW Filter Tatsuya KATSUMOTO Shinpei OSHIMA Ryuji MURATA Hitoshi EBIHARA Kouji WADA
	Summary \| Full Text(in Japanese):PDF (530.3KB)