Yuki SOH

Ultra-Precision Measurement & Fabrication Technology of LSI and Its Materials for the Next Generation -- Toward the Atomic Scale Production Applying Novel Opt-Mechanical Methods --
Hiroshi KUBOTA  Yuki SOH  Seiya MATSUKAWA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2012/08/01
Vol. J95-C  No. 8  pp. 156-159
Type of Manuscript: Special Section PAPER (Special Issue on Expectations and Challenges of LSI and High-density Packaging Technology for Heterogeneous Device Integration)
Category: 
Keyword: 
next generation LSI,  mass-production,  atomic scale production, 
  Summary |  Full Text(in Japanese):PDF (619.2KB)
High-Density Mounting of Piezoresistive Pressure Sensors Using Reticle Free Exposure Method for Suppressing Fluctuation of Sensitivity
Yuki SOH  Naoki HAYASHI  Taishi ENDO  Katsuhiko WAKASUGI  Takeshi ICHIKAWA  Shigeyuki MATSUMOTO  Hiroshi KUBOTA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2008/11/01
Vol. J91-C  No. 11  pp. 617-626
Type of Manuscript: Special Section PAPER (Special Issue on Leading-Edge Trend of Advanced Packages for Electron Devices and Its Related Topics for High-Density Packaging Process Technologies)
Category: 
Keyword: 
piezo-resistive membrane pressure sensor,  high-density package,  tactile sensor,  reticle free exposure method,  mask less exposure,  wet etching process, 
  Summary |  Full Text(in Japanese):PDF (922.3KB)
Development of Three-Dimentional Lithography System for High-Density Packaging
Fumito IMURA  Kouta HIDAKA  Yuki SOH  Naoki HAYASHI  Masao YOSHIOKA  Hiroshi KUBOTA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2007/11/01
Vol. J90-C  No. 11  pp. 741-748
Type of Manuscript: Special Section PAPER (Special Issue on Next Generation High Density Packaging Materials Technology for High Performance Electric Systems)
Category: 
Keyword: 
reticule-free exposure,  MEMS (Micro Electro-Mechanical System),  high-density packaging,  confocal laser scanning microscope,  3-dimenstional flexible-alignment, 
  Summary |  Full Text(in Japanese):PDF (567KB)