Yoshikuni OKADA

Burn-In Test Chip-Carrier for LSI Chips with Micro Pad Pitch
Motohiro SUZUKI  Tokihiko YOKOSHIMA  Yoshikuni OKADA  Hiroshi NAKAGAWA  Masahiro AOYAGI  Masatoshi MIURA  Tsuyoshi TAKAHASHI  Kimiya KITAYAMA  Atsushi ETOU  Tomohiro HIMENO  Akira MARUI 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2009/11/01
Vol. J92-C  No. 11  pp. 712-721
Type of Manuscript: Special Section PAPER (Special Issue on Advanced Packging and Environmentally Conscious Packaging Technologies in Next-Generation Electronic Equipment)
Category: 
Keyword: 
three-dimensional chip integration,  micro-contact bump,  burn-in test,  KGD, 
  Summary |  Full Text(in Japanese):PDF (1.5MB)
Signal Transmission Evaluation of Optical Backplane Model with 10-Gbit/s Optical Transmitter and Receiver Module
Atsushi SUZUKI  Kenji SUZUKI  Yoshitsugu WAKAZONO  Shuji SUZUKI  Takayuki YAMAGUCHI  Hiroshi MASUDA  Kazuhito SAITO  Masao KINOSHITA  Osamu IBARAGI  Katsuya KIKUCHI  Hiroshi NAKAGAWA  Yoshikuni OKADA  Masahiro AOYAGI 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2006/11/01
Vol. J89-C  No. 11  pp. 796-808
Type of Manuscript: Special Section PAPER (Special Issue on Advanced Packaging and Electromagnetic Noise Reduction Technology for Next Generation Electronic Systems)
Category: 
Keyword: 
optical interconnection,  optical backplane,  optical module,  10 Gbit/s,  optical implementation, 
  Summary |  Full Text(in Japanese):PDF (1.8MB)