Publication: C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2012/08/01
Vol. J95-C
No. 8
pp. 164-174
Type of Manuscript: Special Section PAPER (Special Issue on Expectations and Challenges of LSI and High-density Packaging Technology for Heterogeneous Device Integration)
Category:
Keyword:
high-k,
LTCC,
MEMS,
microstrip,
tunable filters,
resistive vias,
high impedance,
RF isolation,
reconfigurable radio end,
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