Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2005/12/01
Vol. E88-A
No. 12
pp. 3471-3478
Type of Manuscript: Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Interconnect
Keyword:
dummy metal,
dummy fill,
interconnect capacitance,
CMP,
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