Tianming NI


A Region-Based Through-Silicon via Repair Method for Clustered Faults
Tianming NI Huaguo LIANG Mu NIE Xiumin XU Aibin YAN Zhengfeng HUANG 
Publication:   
Publication Date: 2017/12/01
Vol. E100-C  No. 12  pp. 1108-1117
Type of Manuscript:  PAPER
Category: Integrated Electronics
Keyword: 
3D ICsyield enhancementTSV redundancyreparabilityadditional delay overhead
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