Tetsuaki WADA

Defect Detection of Passivation Layer by a Bias-Free Cu Decoration Method
Tetsuaki WADA  Shinji NAKANO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/04/20
Vol. E77-C  No. 4  pp. 585-589
Type of Manuscript: Special Section PAPER (Special Issue on LSI Failure Analysis)
Category: 
Keyword: 
semiconductor,  passivation,  defect,  reliability,  humidity test, 
  Summary |  Full Text:PDF (976.6KB)
Barrier Metal Effect on Electro- and Stress-Migration
Tetsuaki WADA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 1994/01/20
Vol. E77-A  No. 1  pp. 180-186
Type of Manuscript: Special Section PAPER (Special Section on Reliability)
Category: Failure Physics and Failure Analysis
Keyword: 
semiconductor,  metal,  barrier metal,  reliability electromigration,  stress-migration, 
  Summary |  Full Text:PDF (1MB)