Shoichi TANIFUJI

A 60 GHz-Band 3-Dimensional System-in-Package Transmitter Module with Integrated Antenna
Noriharu SUEMATSU  Satoshi YOSHIDA  Shoichi TANIFUJI  Suguru KAMEDA  Tadashi TAKAGI  Kazuo TSUBOUCHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/07/01
Vol. E95-C  No. 7  pp. 1141-1146
Type of Manuscript: Special Section PAPER (Special Section on Recent Trends of Microwave Systems and Their Fundamental Technologies)
Category: INVITED
Keyword: 
module,  RFIC,  MMIC,  antenna integration,  millimeter-wave,  SiP,  stud bump, 
  Summary |  Full Text:PDF (6.8MB)
60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules
Satoshi YOSHIDA  Shoichi TANIFUJI  Suguru KAMEDA  Noriharu SUEMATSU  Tadashi TAKAGI  Kazuo TSUBOUCHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/07/01
Vol. E95-C  No. 7  pp. 1276-1284
Type of Manuscript: PAPER
Category: Microwaves, Millimeter-Waves
Keyword: 
millimeter-wave,  60-GHz band,  system-in-package,  vertical interconnection,  copper balls,  WPAN, 
  Summary |  Full Text:PDF (7MB)
Proposal of Heterogeneous Wireless Network with Handover in Application Layer: Feasibility Study Based on Field Trial Results
Suguru KAMEDA  Hiroshi OGUMA  Noboru IZUKA  Fumihiro YAMAGATA  Yasuyoshi ASANO  Yoshiharu YAMAZAKI  Shoichi TANIFUJI  Noriharu SUEMATSU  Tadashi TAKAGI  Kazuo TSUBOUCHI 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 2012/04/01
Vol. E95-B  No. 4  pp. 1152-1160
Type of Manuscript: Special Section PAPER (Special Section on Cognitive Radio and Heterogeneous Wireless Networks in Conjunction with Main Topics of CrownCom2011)
Category: 
Keyword: 
heterogeneous wireless networks,  WLAN,  MBWA,  handover, 
  Summary |  Full Text:PDF (2MB)