Shinya TAKYU


Improvement of Kerf Width Uniformity Using “DAF Mount on Ring Frame First Method”
Yusuke FUMITA Shinya TAKYU Atsushi UEMICHI Kunio YOMOGIDA Keiich HATAKEYAMA Tsuyoshi TAZAWA Yoshinobu OZAKI 
Publication:   - - Abstracts of (Japanese Edition)
Publication Date: 2019/03/01
Vol. J102-C  No. 3  pp. 51-53
Type of Manuscript:  Special Section LETTER (Special Section on Heterogeneous Integrated Packaging Technologies to Lead the Innovation of Social Systems)
Category: 
Keyword: 
Dicing Before GrindingDie Attach Filmalignment of kerf widthDAF mount on ring frame first method
 Summary | Full Text(in Japanese):PDF(583.4KB)

The Influence of Water Absorption of Adhesive Film on Adhesive Film Broken
Keishi FUSE Shinya TAKYU 
Publication:   - - Abstracts of (Japanese Edition)
Publication Date: 2018/02/01
Vol. J101-C  No. 2  pp. 101-102
Type of Manuscript:  Special Section LETTER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
Category: 
Keyword: 
die bonding tapeadhesive film brokendicingpick-up
 Summary | Full Text(in Japanese):PDF(436.8KB)

A Novel Chip Place Process for FO-WLP Using a New Tape Expansion Machine
Masatomo NAKAMURA Shinya TAKYU Naoya OKAMOTO Toshiaki MENJO 
Publication:   - - Abstracts of (Japanese Edition)
Publication Date: 2018/02/01
Vol. J101-C  No. 2  pp. 103-106
Type of Manuscript:  Special Section LETTER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
Category: 
Keyword: 
FO-WLPexpansionexpansion machine deviceexpansion tape
 Summary | Full Text(in Japanese):PDF(619.2KB)

Development of Adhesive Having High Heat Resistance and High Adhesion Force for LED Device
Yutaka NANASHIMA Hidekazu NAKAYAMA Mikihiro KASHIO Shinya TAKYU Hironori SHIZUHATA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2015/11/01
Vol. J98-C  No. 11  pp. 286-288
Type of Manuscript:  Special Section LETTER (Special Section on Technologies of 3D-IC Assembly Which Materialize Advanced Electronic Devices and Leading Assembly Related Materials)
Category: 
Keyword: 
LEDadhesivehigh heat resistancePSQ
 Summary | Full Text(in Japanese):PDF(570.5KB)

Novel Dicing Technologies for Thin Chips Realizing High Chip Strength
Shinya TAKYU Tetsuya KUROSAWA Noriko SHIMIZU Susumu HARADA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2008/11/01
Vol. J91-C  No. 11  pp. 603-609
Type of Manuscript:  Special Section PAPER (Special Issue on Leading-Edge Trend of Advanced Packages for Electron Devices and Its Related Topics for High-Density Packaging Process Technologies)
Category: 
Keyword: 
thin chipbackside grindingdicingdicing before grindingcleaving
 Summary | Full Text(in Japanese):PDF(485.5KB)