Seiki SAKUYAMA


Reliability Testing and Analysis of Adhesive Bonding Sheets for Multi-layer Flexible Substrate
Tomoyuki AKAHOSHI Masaharu FURUYAMA Seiki SAKUYAMA Hiroaki KOZAI Mitsuhiro WATANABE 
Publication:   - - Abstracts of (Japanese Edition)
Publication Date: 2019/03/01
Vol. J102-C  No. 3  pp. 24-29
Type of Manuscript:  Special Section PAPER (Special Section on Heterogeneous Integrated Packaging Technologies to Lead the Innovation of Social Systems)
Category: 
Keyword: 
Bonding sheetflexible printed circuit (FPC)reliabilityhighly accelerated temperature and humidity stress test (HAST)ion migration
 Summary | Full Text(in Japanese):PDF(1.1MB)

Evaluation of Temperature Dependence of Local Stress and CMOS Circuit Properties in Three-Dimensional LSI Design
Shoichi MIYAHARA Hideki KITADA Hiroko TASHIRO Aki DOTE Seiki SAKUYAMA 
Publication:   - - Abstracts of (Japanese Edition)
Publication Date: 2018/02/01
Vol. J101-C  No. 2  pp. 74-82
Type of Manuscript:  Special Section PAPER (Special Section on Heterogeneous Integration Packaging Technologies Realizing Next Generation Mobility Devices)
Category: 
Keyword: 
3D-LSICMOS propertyTSV stresstemperature dependence
 Summary | Full Text(in Japanese):PDF(1.2MB)

Influence of Si-Resistivity on Electrical Properties of TSV and Wiring in Si-IP
Hiroko TASHIRO Takeshi ISHITSUKA Seiki SAKUYAMA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2015/11/01
Vol. J98-C  No. 11  pp. 236-243
Type of Manuscript:  Special Section PAPER (Special Section on Technologies of 3D-IC Assembly Which Materialize Advanced Electronic Devices and Leading Assembly Related Materials)
Category: 
Keyword: 
3D_LSITSVSi interposerSi substrateResistivityelectrical characteristic
 Summary | Full Text(in Japanese):PDF(1.6MB)

Reliability Evaluation in Flip-Chip Interconnection between Cu-pillar and Sn-Bi Solder Alloy System
Kozo SHIMIZU Seiki SAKUYAMA Kei MURAYAMA Takashi KURIHARA Mitsutoshi HIGASHI 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2013/11/01
Vol. J96-C  No. 11  pp. 393-399
Type of Manuscript:  Special Section PAPER (Special Issue on 3D Chip Stacking and Advanced Design/Evaluation Technologies for Future Electronic Packaging)
Category: 
Keyword: 
Cu-pillareutecticSn-Bi solderflip-chipagingreliabilitythermal cycledrop impact test
 Summary | Full Text(in Japanese):PDF(2MB)

Microstructure and Mechanical Properties of Sb Addition Eutectic Sn-Bi Solder
Seiki SAKUYAMA Toshiya AKAMATSU Keisuke UENISHI Takehiko SATO 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2010/11/01
Vol. J93-C  No. 11  pp. 485-492
Type of Manuscript:  Special Section PAPER (Special Section on Advanced Packaging and Its Related Topics about Evaluation and Analysis Technologies for High-Density Packaging)
Category: 
Keyword: 
Sn-Bi-Sb solderlow melting pointductilitymicrostructure
 Summary | Full Text(in Japanese):PDF(1.9MB)

Consideration of Tin Whisker Growth Mechanism for Lead-Free Plating
Seiki SAKUYAMA Michinori KUTAMI 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2009/11/01
Vol. J92-C  No. 11  pp. 606-612
Type of Manuscript:  Special Section PAPER (Special Issue on Advanced Packging and Environmentally Conscious Packaging Technologies in Next-Generation Electronic Equipment)
Category: 
Keyword: 
lead-free platingwhiskerrecrystallizationincubation period
 Summary | Full Text(in Japanese):PDF(1.1MB)

Low Temperature Sn-Bi Soldering Tecnology for Low Stress Packaging
Seiki SAKUYAMA Toshiya AKAMATSU Keisuke UENISHI Takehiko SATO 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2008/11/01
Vol. J91-C  No. 11  pp. 534-541
Type of Manuscript:  Special Section PAPER (Special Issue on Leading-Edge Trend of Advanced Packages for Electron Devices and Its Related Topics for High-Density Packaging Process Technologies)
Category: 
Keyword: 
Sn-Bisolderlow melting pointpackagingreliability
 Summary | Full Text(in Japanese):PDF(1.4MB)