Publication: C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2008/11/01
Vol. J91-C
No. 11
pp. 627-634
Type of Manuscript: Special Section PAPER (Special Issue on Leading-Edge Trend of Advanced Packages for Electron Devices and Its Related Topics for High-Density Packaging Process Technologies)
Category:
Keyword:
lead-free solder,
solder bumping,
hydrogen plasma,
hydrogen radicals,
flux residue,
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