Qiong YU


Failure Process and Dynamic Reliability Estimation of Sealed Relay
Xuerong YE  Jie DENG  Qiong YU  Guofu ZHAI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2011/09/01
Vol. E94-C  No. 9  pp. 1375-1380
Type of Manuscript: Special Section PAPER (Special Section on Recent Development of Electro-Mechanical Devices – Papers selected from International Session on Electro-Mechanical Devices (IS-EMD2010) and other research results –)
Category: 
Keyword: 
sealed relayfailure processtime parametergap timedynamic reliability estimation
  Summary |  Full Text:PDF (1.5MB)

The Discrimination of Contact Failure Mechanisms by Analyzing the Variations of Time Parameters for Relays
Shujuan WANG  Qiong YU  Guofu ZHAI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2010/09/01
Vol. E93-C  No. 9  pp. 1437-1442
Type of Manuscript: Special Section PAPER (Special Section on Recent Development of Electro-Mechanical Devices (Selected Papers from IS-EMD2009))
Category: 
Keyword: 
relaystime parameterslife testcontact failure mechanismcontact failure process
  Summary |  Full Text:PDF (1.6MB)

Study on Contact Failure Mechanisms of Accelerated Life Test for Relay Reliability
Shujuan WANG  Qiong YU  Li REN  Wanbin REN 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2009/08/01
Vol. E92-C  No. 8  pp. 1034-1039
Type of Manuscript: Special Section PAPER (Special Section on Recent Development of Electro-Mechanical Devices (IS-EMD2008))
Category: Relacys & Switches
Keyword: 
relaysaccelerated life testload current stressfailure mechanismfailure model
  Summary |  Full Text:PDF (1.2MB)