Publication: C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2009/11/01
Vol. J92-C
No. 11
pp. 646-654
Type of Manuscript: Special Section PAPER (Special Issue on Advanced Packging and Environmentally Conscious Packaging Technologies in Next-Generation Electronic Equipment)
Category:
Keyword:
stacking technology,
wafer-to-wafer,
direct connection between TSV and bump,
yield of stacked device,
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