Masaki NAKANISHI

A Method of Reducing Communication Costs for Parallel Simulations of Quantum Computation
Akihiro SHIBATA  Takashi NAKADA  Masaki NAKANISHI  Shigeru YAMASHITA  Yasuhiko NAKASHIMA 
Publication:   D - Abstracts of IEICE TRANSACTIONS on Information and Systems (Japanese Edition)
Publication Date: 2010/03/01
Vol. J93-D  No. 3  pp. 253-264
Type of Manuscript: PAPER
Category: 
Keyword: 
quantum computer,  quantum computer simulations,  quantum circuit,  swap gate,  distributed memory parallel computers, 
  Summary |  Full Text(in Japanese):PDF (540.2KB)
Through-Silicon Via Interconnection for 3D Integration Using Room-Temperature Bonding
Naotaka TANAKA  Yasuhiro YOSHIMURA  Michihiro KAWASHITA  Takahiro NAITO  Toshihide UEMATSU  Chuichi MIYAZAKI  Norihisa TOMA  Kenji HANADA  Masaki NAKANISHI  Takafumi KIKUCHI  Takashi AKAZAWA 
Publication:   C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)
Publication Date: 2008/11/01
Vol. J91-C  No. 11  pp. 542-551
Type of Manuscript: Special Section PAPER (Special Issue on Leading-Edge Trend of Advanced Packages for Electron Devices and Its Related Topics for High-Density Packaging Process Technologies)
Category: 
Keyword: 
through silicon via (TSV),  mechanical caulking,  room temperature bonding,  dry etching,  3D-interconnection, 
  Summary |  Full Text(in Japanese):PDF (2.4MB)
Quantum Protocols for Message Sealing and Its Security
Masaki NAKANISHI 
Publication:   A - Abstracts of IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences (Japanese Edition)
Publication Date: 2007/05/01
Vol. J90-A  No. 5  pp. 385-392
Type of Manuscript: Special Section PAPER (Special Section on Quantum Information Processing)
Category: 
Keyword: 
quantum cryptography,  quantum seals, 
  Summary |  Full Text(in Japanese):PDF (310.3KB)