Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1993/04/20
Vol. E76-C
No. 4
pp. 572-576
Type of Manuscript: Special Section PAPER (Special Issue on Sub-Half Micron Si Device and Process Technologies)
Category: Device Technology
Keyword:
SOI bipolar transistors,
thin buried layer,
wafer bonding,
selective polishing,
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